Extreme Networks E4G Series Manual de usuario descargar pdf (Pagina 2)

Pocket Guide 2

Product Name and Role Key Values Key Dierentiators

Black Diamond 8000

Campus Edge/Core, Data Center or

SP aggregation switch

• Campus edge/core, data center edge/core or

SP aggregation switch

• Excellent cost-eective performance with 1GE,

10GE and 40GE interfaces

• 3.8Tbps capacity with 2.8 Bpps throughput

• From 10MbE to 40GbE coverage

• High-density 1GbE and 10GbE connectivity with

cost-eective 40GbE

• Optional PoE

• Versatile extensible backplane architecture with

multiple cost/scale IO options

• Cost-eective Strata-XGS technology

• XL blades for internet connectivity

• MLAG, limited ISSU and EAPS/ERPS support

(~50ms failover)

• SDN and MPLS support

• Uniﬁed, modular XOS operating system

Fixed

Summit X770

High-density ToR data center switch

• High-density, low latency Top

of Rack (ToR) switch with 32 x 40GE interfaces

• Can support up to 104 ports of 10GE

• Highest density in the industry

• Low latency (less than 600ns)

• 1588 PTP timing support

• Designed to meet NEBS requirements

• Optional DC power

• Modular fans with reversible airﬂow

• Heterogeneous stacking with other Summit

switches

• EAPS/ERPS support(~50ms failover)

• VEPA and TRILL support

• Uniﬁed, modular XOS operating system

Summit X670V

Verasatile ToR data center switch

• Top of Rack (ToR) switch with 48 x 10GE

ﬁber interfaces

• Both copper and ﬁber options available

• 40 GE uplinks

• High density

• Low latency (less than 920ns)

• Copper model supports dual ports for either

copper or ﬁber to address distance issues

• MPLS support

• Designed to meet NEBS requirements

• Optional DC power

• Modular fans with reversible airﬂow

• Heterogeneous stacking with other Summit

switches

• EAPS/ERPS support (~50ms failover)

• VEPA and TRILL support

• Uniﬁed, modular XOS operating system

7100K-Series

High density 10 Gigabit Ethernet

data center switch

• Data center Top of Rack switch with 24 or 48

1GE and 10GE interfaces

• Supports advanced features such as Data

Center Bridging (DCB) and Virtual Switch

Bonding (VSB)

• Identical software features as the S-Series

and K-Series modular switches (without

CoreFlow2 support)

• High-density, cost-eective 10Gbase-T support

• 40GE uplinks

• Dynamic policy support

• Modular fans with reversible airﬂow

• VSB stacking with 7100G-Series

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